High density micro holes on probe cards required slow, expensive manufacturing process.
Integrated accelerated motion control with ultra fast micro mill shaves hours off production time with accuracy within 0.00008 inches (2µm).
High density precision micro hole drilling solution delivers faster production speed, higher quality finished parts and reduced cost.
Probe card drilling for the semiconductor industry represents perhaps the epitome of a high accuracy micro-machining application: a single ceramic probe card can require upwards of 50,000 micro holes in a 1 inch by 1 inch area. This volume of work means that completing one probe card can take several days of non-stop drilling. The significant time and tooling investment required by every probe card makes any flaws or errors hugely expensive, and places a great emphasis on speed while demanding micron-level accuracy.
A major contract manufacturer in the semiconductor industry was looking for a better, faster way to produce probe cards. They turned to Microlution and found the company’s high-speed, high-density perforation system could provide a dramatic competitive advantage. Based on the 5100-S platform, the Microlution solution integrates high acceleration motion control with the platform’s ultra fast, ultra precise micro milling technology.
The result is a high density precision micro hole drilling solution that cut the probe card production process time from 30-50 percent – when running the exact same G-code programming as legacy manufacturing equipment. Metrology inspections proved that the 5100-S was holding straight line hole dimensioning better than 0.00008 inches (2µm) on finished parts. Because of these outstanding results, the contract manufacturer ordered their first 5100-S. The success of that first machine led this industry leading company to expand their fleet of Microlution machines; they now run six probe card workstations.